document : srg00000nh revision : a0 page : 1 of 6 specification for approval 3w 3637 low resistance chip resi stor (lead free / halogen free) 1. scope this specification applies to 9.14mm x 9.4mm size 3w, fixed meta l foil with ceramic carrier current sensing resistors used in electronic equipment. 2. type designation rl36370 ? C (1) (2) (3) where (1) series no. (2) resistance value : for example : r002 = 2m r010 = 10m (3) tolerance : f = 1% g = 2% j = 5% 3. outline designation and marking 3-1 outline designation figure 1. construction and dimensions (1) substrate alumina 96% (2) resistor ni alloy (3) terminals sn (on cu ) (4) protection coat heat resistive epoxy resin (5) marking epoxy resin dimensions (mm) code letter 3637 l 9.14 0.25 w 9.40 0.25 c 1.55 0.25 d 0.85 0.25 a (1m ) 3.5 0.25 ( R2m ) 2.2 0.25 t 0.88 0.20
document : srg00000nh revision : a0 page : 2 of 6 specification for approval 3-2 marking resistance value is marked on the top surface. ex.) 2m r002 10m r010 4. ratings 4-1 specification power rating* 3 w resistance value 1 m ~ <2 m 2 ~ 10m temperature coefficient of resistance 0~+150 ppm/ 100ppm/ resistance tolerance 1%, 2%, 5% insulation resistance over 100m rated voltage (v) ( p*r) 1/2 note * : power rating is based on continuous full load operation at rated ambient temperature of 70 . for resistors operated at ambien t temperature in excess of 70 , the maximum load shall be derated in accordance with the following curve. ambient temperature( ) 0 170 70 100 rated load(%) -55 figure 2. power temperature derating curve 4-2 operation and storage temperature range -55 to +170
specification for approval document : srg00000nh revision : a0 page : 3 of 6 5. life test test item condition of test requirements short time overload 5 * rated power for 5 seconds refer to jis c 5201-1 4.13 r : (0.5%+0.0005 ) thermal shock -55 ~150 1,000 cycles, 15 min at each extreme condition refer to jis c 5201-1 4.19 r : (1.0%+0.0005 ) low temperature storage kept at -55 , 1,000 hours refer to jis c 5201-1 4.23.4 r : (1.0%+0.0005 ) resistance to soldering heat dipped into solder at 270 5 for 20 1 seconds refer to jis c 5201-1 4.29 r : (0.5%+0.0005 ) load life rated voltage for 1.5hours followed by a pause 0.5hour at 70 3 . cycle repeated 1000 hours refer to jis c 5201-1 4.25 r : (1.0%+0.0005 ) damp heat with load 40 2 with relative humidity 90% to 95%. cycle repeated 1,000 hours refer to jis c 5201-1 4.24 r : (1.0%+0.0005 ) high temperature exposure kept at 170 for 1,000 hours refer to jis c 5201-1 4.23.2 r : (1.0%+0.0005 ) solderability temperature of solder : 245 5 immersion duration : 3 0.5 seconds refer to jis c 5201-1 4.17 uniform coating of solder cover minimum of 95% surface being immersed mechanical shock 100 g?s for 6milliseconds. 5 pulses refer to jis c 5201-1 4.21 r : (0.5%+0.0005 ) bending test glass-epoxy board thickness : 1.6mm bending width : 2mm between the fulcrums : 90mm refer to jis c 5201-1 4.33 r : (0.5%+0.0005 )
document : srg00000nh revision : a0 page : 4 of 6 specification for approval 6. recommended solder pad dimensions 3637 a b c d e 1m 4.3 9.9 1.68 0.6 1.9 2~10m 2.95 9.9 1.68 0.6 4.6 unit : mm 7. packaging 7-1 dimensions 7-1-1 tape packaging dimensions symbol ao bo ko po p1 p2 spec 9.60.10 9.90.10 1.2 max. 4.00.10 12.00.10 2.00.10 symbol t e f do d1 w spec 0.4 max. 1.750.10 7.500.10 1.50.1 1.5 max. 16.00.2
document : srg00000nh revision : a0 page : 5 of 6 specification for approval 7-1-2 reel dimensions a 17.4 1.0 f 20.2 0.1 b 2.0 0.2 g 13.5 0.5 c 99 1.0 h 2.5 0.5 d 380 0.5 unit : mm f g h d b a c
document : srg00000nh revision : a0 page : 6 of 6 specification for approval 7-2 peel strength of top cover tape the peel speed shall be about 300mm/minute the peel force of top cover ta pe shall between 0.1 to 0.7n 7-3 number of taping 1,000 pieces / reel 7-4 label marking the following items shall be marked on the reel. (1) type designation (2) quantity (3) manufacturing date code (4) manufacturer?s name (5) the country of origin 165 ~ 180 top cover tape carrier tape 0.1 ~ 0.7n
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